Realize your nano vision
Karin Hedsten

     Karin Hedsten

Processing competence: Has extpertise in MEMS/MOEMS, microoptics and general silicon processing, but also from integration of different microtechnologies building more advanced systems. Experience from integration of non-standard material (polymers) and use of replication technique in silicon processing. Also has several years of industrial experience from R&D and project management in SME and start-up.

Tel: +46 (0)31 772 84 70

Mobile: +46 (0)76 139 5076

List of tools where Karin Hedsten is tool responsible

 NameTypeTool Id
DetailsWafer Inspection System - IR 127
DetailsMask aligner - Suss MA/BA 6 #1Mask aligner205
DetailsSubstrate bonder - Suss SB6Substrate Bonder269
DetailsDry etch ICP - STS - Deep Silicon etchICP etch307
DetailsRTP - STEAGRapid Thermal Process402
DetailsCritical Point Dryer - Bal-TecCritical Point Dryer1170
DetailsMask aligner - Suss MA 6 #2Mask aligner213
DetailsCVD - Aixtron - CNT 1440
DetailsFurnace - LentonFurnace1012
DetailsALD - Oxford FlexAlAtomic Layer Deposition445
DetailsSpinner - Suss RCD8 209
DetailsHotplate - Wenesco - SU8/BCB 247
DetailsCritical point dryer - Tousimis 438