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Other processes

  Other Processes
Here are found processes which do not belong to the other categories, e.g., electroplating, lapping, critical point dryer and sealing of wafer boxes.
 
Click on heading to sort the table.
(Extract from LIMS)
 
 NameManufacturerModel
DetailsRoomRElabresponsible
DetailsRenrumElabAccess
DetailsBlästerGuyson Europlast4 SF-Select (med inställbar hjöd) samt utsugningsf
DetailsBalanceBalanceVåg
DetailsQuicksealQuicksealInplastning
DetailsKyl & frysElectroluxKylskåp/frys
DetailsRörtvättKTHhandmade
DetailsTesttoolTest AB eller OY eller LtdSpecial
DetailsLab supportELABVirtual tool
DetailsLäcksökarenPfeiferQualyTest HLT260
DetailsFiber annealÅngpaneföreningenSpecial design
DetailsLIMSElabAccess
DetailsTLE labTanner15.10
DetailsFs Laser system 1CoherentMira 900
DetailsFs Laser system 2Coherent and APEChameleon Ultra II + APE Harmonics generator
DetailsCritical Point Dryer AlbanovaLeicaEM CPD 300
DetailsuFAB Femtosecond LaserMSTMST lab
DetailsCleanroomElectrumElectrum Laboratory
DetailsSpeed mixerMSTMST lab
DetailsNikon Microphot-FXANikonMicrophot-FXA
DetailsCNC-milling machineMinitechMini-Mill
DetailsCMPIPEC / AxusAvanti 472
DetailsCO2 LaserUniversal Laser Inc.VSL 2.3
DetailsLight SoakerWavelabsWavelabs
DetailsCPDtousimisAutomegasamdris-938
DetailsNanoscribeNanoscribe3D Microfabrication System Photonic Professional G
DetailsExternal chemistry labN/AN/A
DetailsSentaurusSynopsysR-2020.09
DetailsFormlabs SLA printer 1 FormlabsForm 3
DetailsFormlabs SLA printer 2FormlabsForm 3
DetailsTEK 370ATektronix370A
DetailsIwatsuIwatsuI-V 5KV 400A
DetailsKeysightKeysight B5105B
DetailsDPT DeviceHollander ResearchSiC power discretes
DetailsDPT-PMHollander ResearchSiC power modules
DetailsSCM--
DetailsCalib--
DetailsThermal StreamTBDTBD
DetailsSurge current measurementsTBDTBD
DetailsRuggedness tests TBDTBD

 

2020-06-30 Quality group (P)